Semiconductor IC Packaging and Engineering Development
Assembly engineering professional with a ~13-year career with corporations including Texas Instruments, Skyworks Solutions, Maxim Integrated Circuits and Avago Technologies.
§ TECHNOLOGIES: Solder-bump and Cu-pillar flip-chip bumping and assembly; Copper wire-bond; Fine-pitch SMT; Ceramic, laminate and coress substrate development; RF MEMS; Characterization or capability development for new/emerging applications. Track record of transfer to production and interface with foundries, material and component suppliers and assembly turn-key partners.
§ END APPLICATIONS: RF, Mixed Signal / Analog, Wireless, Handheld, Consumer, Medical, Automotive, Infrastructure, Telecom and Emerging Markets
§ METHODOLOGIES: Six-sigma, Lean Manufacturing, Operational Excellence Initiatives, Engineering Change Management
§ CUSTOMER INTERFACE: Direct interaction with Tier-1 customers across Asia (including Japan), Europe, North America and Scandinavia for R&D, engineering and business development
§ SOFT SKILLS: Excellent influencing and mentoring skills.
§ OTHER: Quality and Reliability, PLM, New Product Introduction (NPI). Scientific publications, issued and pending patents.
Please contact the skill set owner if you have an imminent employment opportunity, or one currently available to discuss. Thank you.