Semiconductor IC Packaging and Engineering Development

Assembly engineering professional with a ~13-year career with corporations including Texas Instruments, Skyworks Solutions, Maxim Integrated Circuits and Avago Technologies.
§ TECHNOLOGIES: Solder-bump and Cu-pillar flip-chip bumping and assembly; Copper wire-bond; Fine-pitch SMT; Ceramic, laminate and coress substrate development; RF MEMS; Characterization or capability development for new/emerging applications. Track record of transfer to production and interface with foundries, material and component suppliers and assembly turn-key partners.
§ END APPLICATIONS: RF, Mixed Signal / Analog, Wireless, Handheld, Consumer, Medical, Automotive, Infrastructure, Telecom and Emerging Markets
§ METHODOLOGIES: Six-sigma, Lean Manufacturing, Operational Excellence Initiatives, Engineering Change Management
§ CUSTOMER INTERFACE: Direct interaction with Tier-1 customers across Asia (including Japan), Europe, North America and Scandinavia for R&D, engineering and business development
§ SOFT SKILLS: Excellent influencing and mentoring skills.
§ OTHER: Quality and Reliability, PLM, New Product Introduction (NPI). Scientific publications, issued and pending patents.