Experienced and versital semiconductor engineer and manager

Best Practices. Established a common methodology for the production planning of product introductions. Results: Improved production planning and reduced variations between planning cycles.

Re-engineered a stand-alone electrical test system into a manufacturing system. Organized the team and directed the efforts to use the existing systems in a new reliable integrated solution. Results: The system eliminated a manufacturing bottleneck and operated reliability for the life of the facility eliminating the need to purchase different equipment.

Continuing Process Improvement. Directed work on wafer level reliability testing in support of resolving reliability failure mechanisms limiting product reliability. Results: The developed tests and evaluation methods became a standard and were adopted by a supplier and marketed as an industry standard.

Cross-Cultural Team Building. Reorganized two internationally located product teams into one team with a promoted local leader. Result: Increased team moral, cooperation, and cohesiveness leading to increased responsibilities and ownership of activities. The team also improved their interaction and response to the production facility.

Package Technology. Directed the technical evaluation of an alternate flip chip process for volume manufacturing. Engaged the technical experts with suppliers for equipment and process evaluations. Formulated the management justification clarifying both the need and capability of alternate processes. Result: Changed the technology to enable future capability without retooling.

Product Management. Coordinated the product introduction of the first K8 dual core microprocessor. Managed the preparation and scheduling of production, test, and assembly. Coordinated the debug activities between test and design teams. Results: Initial limited production was enabled ahead of schedule.

Managed the K7 microprocessor to achieve incrementally increasing performance targets through process and design adjustments. Coordinated activities between process, design, and debug teams. Results: Maintained the products competitive capabilities until the next generation microprocessor was a viable replacement product.

Startup/Turnaround/Consolidation. Guided international engineering teams in defining and staffing the organizations and through the start up of operations. Established training plans and coordinated hands on training activities at an existing facility. Results: Facility startup of operations completed in record time and awarded “Fab of the Year” by the Semiconductor Manufacturing Organization.

Conceptual Design. Developed product introduction scenario evaluation tool for different verification and debug cycles showing resource and constraints for planned product programs. Results: Enabled product priority management to maximize ROI and provide realistic product plans to customers.

Conduct Experiments. Directed the equipment selection process for parametric test in the Fab 25 facility. Defined the evaluation criteria and organized the supplier evaluations. Results: Established a new standard test system for the facility.

Logic/Scientific Thinking. Established the business plan justification for the flip chip facility. Researched alternative and completed a competitive analysis showing the financial impact of each choice. Results: Succeeded in proceeding with the facility in 2 phases that minimized the financial impact.

Process Development. Defined/Managed/Developed the Fab 25 Product Engineering organization. Staffed and organized the failure analysis and data base equipment selection. Results: Created new failure analysis capability resulting in rapid yield learning and process improvement achieving 20 to 30% product yield improvement.

Defined/Developed process flows, integrating new processes for logic and micro-controller products. Organized process evaluations and coordinated with product groups on product requirements and evaluations. Results: Delivered processes capable of meeting product requirements including some with operations up to 10 Volts, eliminating the need to find an outside manufacturing source.

Product Evaluation. Organized the engineering testing and evaluation efforts to address a product reliability problem. Identified an oxide failure mechanism as the cause. Results: Developed Design, Process, and layout changes eliminating the failure mechanism and allowing products to meet reliability standards.